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dc.contributor.advisorDhariwal, Dr Resham S.
dc.contributor.advisorDesmulliez, Professor Marc Y. P.
dc.contributor.authorKay, Robert William
dc.date.accessioned2009-04-27T09:03:36Z
dc.date.available2009-04-27T09:03:36Z
dc.date.available2011-02-14
dc.date.issued2008-07
dc.identifier.urihttp://hdl.handle.net/10399/2193
dc.description.sponsorshipMicroStencil Ltden
dc.format.extent23112 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherHeriot-Watt Universityen
dc.publisherEngineering and Physical Sciencesen
dc.rightsAll items in ROS are protected by the Creative Commons copyright license (http://creativecommons.org/licenses/by-nc-nd/2.5/scotland/), with all rights reserved.
dc.titleNovel micro-engineered stencils for flip-chip bonding and wafer level packagingen
dc.typeThesisen


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