Optoelectronic devices and packaging for information photonics
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This thesis studies optoelectronic devices and the integration of these components onto optoelectronic multi chip modules (OE-MCMs) using a combination of packaging techniques. For this project, (1×12) array photodetectors were developed using PIN diodes with a GaAs/AlGaAs strained layer structure. The devices had a pitch of 250μm, operated at a wavelength of 850nm. Optical characterisation experiments of two types of detector arrays (shoe and ring) were successfully performed. Overall, the shoe devices achieved more consistent results in comparison with ring diodes, i.e. lower dark current and series resistance values. A decision was made to choose the shoe design for implementation into the high speed systems demonstrator. The (1x12) VCSEL array devices were the optical sources used in my research. This was an identical array at 250μm pitch configuration used in order to match the photodetector array. These devices had a wavelength of 850nm. Optoelectronic testing of the VCSEL was successfully conducted, which provided good beam profile analysis and I-V-P measurements of the VCSEL array. This was then implemented into a simple demonstrator system, where eye diagrams examined the systems performance and characteristics of the full system and showed positive results. An explanation was given of the following optoelectronic bonding techniques: Wire bonding and flip chip bonding with its associated technologies, i.e. Solder, gold stud bump and ACF. Also, technologies, such as ultrasonic flip chip bonding and gold micro-post technology were looked into and discussed. Experimental work implementing these methods on packaging the optoelectronic devices was successfully conducted and described in detail. Packaging of the optoelectronic devices onto the OEMCM was successfully performed. Electrical tests were successfully carried out on the flip chip bonded VCSEL and Photodetector arrays. These results verified that the devices attached on the MCM achieved good electrical performance and reliable bonding. Finally, preliminary testing was conducted on the fully assembled OE-MCMs. The aim was to initially power up the mixed signal chip (VCSEL driver), and then observe the VCSEL output.